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4 lead surface package SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 1x-dip-switch SPST Copal_CHS-01A, Slide, row spacing 7.62 mm (300 mils), Socket 48-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 10x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 505AB (see ON Semiconductor 506AH.PDF DFN, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081703_C_DC6.pdf), generated with kicad-footprint-generator JST ZE series connector, B2P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-128-02-xx-DV-PE-LC, 28 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Pin ePad 3mm x 3mm (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081731_C_DE14MA.pdf Linear UKG52(46) package, QFN-52-1EP variant (see http://cds.linear.com/docs/en/datasheet/3886fe.pdf MLF, 6 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AB), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-20DP-2DSA, 10 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.15 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole straight Samtec HPM power header series 11.94mm post length, 1x06, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x10 5.08mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x18, 1.27mm pitch, double rows Through hole pin header THT 1x21 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x14 1.00mm single row Through hole angled pin header, 2x07, 2.54mm pitch, double rows Surface mounted pin header THT 2x07 2.00mm double row Through hole angled pin header, 1x12, 2.00mm pitch, double rows Surface mounted pin header THT 2x03 2.54mm double row surface-mounted straight pin header, 2x31, 2.00mm.

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