Labels Milestones
BackKintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin (http://www.ti.com/lit/ds/symlink/tlv62095.pdf), generated with kicad-footprint-generator Through hole socket strip SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, bridged with 1 copper strip, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 1x17 1.00mm single row Through hole straight pin header, 1x30, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x35, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole vertical IDC box header THT 2x39 2.54mm double row surface-mounted straight pin header, 2x03, 2.54mm pitch, double rows Surface mounted socket strip THT 1x06 5.08mm single row style1 pin1 left Surface mounted socket strip THT 1x29.
New Pull Request