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15.8x17.7x2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC66_Hardware_Design_V1.1.pdf GSM NB-IoT module BC95 Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case CD636 (https://ww2.minicircuits.com/case_style/CD636.pdf) following land pattern PL-176, including GND vias (https://ww2.minicircuits.com/pcb/98-pl012.pdf Mini-Circuits top-hat case DB1627 (https://ww2.minicircuits.com/case_style/DB1627.pdf Footprint for mini circuit case CD542, Land pattern PL-094, pads 5 and 6); middle of slider panel (between steps 5 and 6); middle of slider panel (between steps 5 and 6); middle of slider panel (between steps 5 and 6 // manual step (featuring debouncing!), sequencer cascading, basic glide (for portamento), attack decay sustain release envelope generator synth module. Layout and panel are Kosmo format. * [Schematic](Docs/precadsr.pdf) * PCB layout: make power connection traces larger; MK uses .6mm this means from the front panel 24ca7abc85681936397a2802c8155420fcaf679c Added schmancy pcb for v2 front panel design and includes 2.5mm.

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