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Pad 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic Micro Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (SS)-5.30 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 2x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD DIP Switch SPST Slide 7.62mm 300mil 1x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 4x-dip-switch SPST Copal_CHS-04A, Slide, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 10-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 2x-dip-switch SPST , Slide, row.

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