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Package OnSemi CASE 100AQ for QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF OnSemi CASE 100CY, light-direction upwards, see https://www.everlight.com/file/ProductFile/ITR1201SR10AR-TR.pdf reflective opto couple photo coupler IR Receiver Vishay TSOP-xxxx MOLD Oscillator, DIP8, Large Pads, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf Miniature Crystal Clock Oscillator EuroQuartz XO32 series, http://cdn-reichelt.de/documents/datenblatt/B400/XO32.pdf, 3.2x2.5mm^2 package Miniature Crystal Clock Oscillator EuroQuartz XO91 series, http://cdn-reichelt.de/documents/datenblatt/B400/XO91.pdf, hand-soldering, 7.0x5.0mm^2 package SMD Crystal EuroQuartz MQ2 series http://cdn-reichelt.de/documents/datenblatt/B400/MQ.pdf, 7.0x5.0mm^2 package SMD Crystal SERIES SMD7050/4 https://www.foxonline.com/pdfs/FQ7050.pdf, hand-soldering, 7.0x5.0mm^2 package FOX SMD Crystal Seiko Epson SG-8002JC https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC, 10.5x5.0mm^2 package SMD Crystal Seiko Epson MC-405 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf, 9.6x4.1mm^2 package SMD Crystal Seiko Epson MC-406 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf, 9.6x4.1mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002CA https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, hand-soldering, 5.0x3.2mm^2 package 14-lead dip package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, off-center ball grid, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA.

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