3
1
Back

Body (http://www.futurlec.com/Datasheet/Memory/628128.pdf), reverse mount TSOP I 32 reverse TSOP-I, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430g2755.pdf#page=70 JEDEC MO-220 variation VJJD-2), generated with kicad-footprint-generator JST ZE horizontal JST ZE series connector, BM03B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py DSO DSO-8 SOIC SOIC-8 Infineon PG-DSO 12 pin, exposed pad, 4x4mm body, pitch 0.5mm, thermal vias in pads, 5 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator ipc_gullwing_generator.py PowerPAK 1212-8 Single Zetex, SMD, 8 pin DIP socket | | | | | | Tayda | A-1624 or A-2969 | | | | | | 1 | | | | | | U1 | 1 | Conn_01x07 | \*(optional) SIP socket, 2.54 mm, 1x4 Pin header, 2.54 mm, 1x2 (see [build notes](build.md)) | | | | | | | | | | | | | Tayda | A-805 | | | | C1, C11, C12 | 2 | 1N5817 | Schottky diode | Tayda | A-1847 | | S3 | 1 | ICM7555xP .

New Pull Request