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Inductor toroid mount Lodestone Pacific, vertical toroid mount, 16AWG/1.27mm holes, http://www.lodestonepacific.com/CatKpdf/VTM_Series.pdf Lodestone Pacific, vertical toroid mount, 16AWG/1.27mm holes, http://www.lodestonepacific.com/CatKpdf/VTM_Series.pdf Lodestone Pacific, 40.64mm diameter vertical toroid mount, 11x19mm, 6 pins, pitch 7.5mm, size 22.5x11mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310731_RT026xxHBLU_OFF-022792U.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_TE-Connectivity THT Terminal Block Phoenix MPT-0,5-10-2.54 pitch 2.54mm DCDC-Converter, RECOM, RECOM_R-78B-2.0, SIP-3, pitch 2.54mm, size 30.94x6.5mm^2, drill diamater 1.3mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wire, reinforced insulation, conductor diameter 1.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TQFP120 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor 506BU.PDF 8-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 16 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator ipc_gullwing_generator.py Infineon PG-DSO.

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