Labels Milestones
BackTexas Instruments DSBGA BGA Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBJ0008 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7.
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- Connector, LY20-34P-DT1, 17 Circuits (https://www.molex.com/pdm_docs/sd/2005280170_sd.pdf), generated with.
- -0.243766 -0.29707 0.923216 vertex 6.36396 -6.36396 3.82299.
- Normal -0.0820835 -0.0815518 0.993283 vertex -5.59201 4.18951 7.89187.