Labels Milestones
BackXBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package.
- Fireball/Fireball_panel.kicad_dru RV4 FM LVL R5 PWM.
- Vertex -3.16429 1.31069 6.59 facet normal 0.630656.
- Mpn: 39-28-910x, 5 Pins per row.
- Raster, 2.5x2.5mm package, pitch 0.5mm.
- 2018-03-14 21:06:04 -07:00 From cb3a50e19a42a9ab425057cfa1f9427c1c21d019.