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Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 495, 4.4x4.38mm, 100.

• 0.0896953 0.0482711 0.994799 vertex -5.83533.
• 4.166407e+000 -1.657257e+000 2.491820e+001 facet normal -3.278595e-01.
• 7.4763 4.9955 3 vertex -8.81921 -1.75094 3 vertex.

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