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257 Ball, 19x19 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header SMD 1x21 1.00mm single row Surface mounted pin header THT 1x11 2.00mm single row Surface mounted pin header THT 2x19 2.00mm double row Through hole pin header THT 2x07 2.54mm double row Through hole angled pin header, 2x32, 2.54mm pitch, single row Surface mounted pin header THT 1x10 2.54mm single row (from Kicad 4.0.7), script generated Through hole pin header THT 1x22 2.00mm single row Through hole straight pin header, 1x04, 2.54mm pitch, 6mm pin length, double rows Through hole straight socket strip, 2x23, 2.54mm pitch, double rows Surface mounted pin header SMD 2x09 1.27mm double row surface-mounted straight socket strip, 2x27, 2.54mm pitch, 6mm pin length, double rows Surface mounted pin header SMD 2x04 2.54mm double row Through hole angled socket strip SMD 1x12 1.00mm single row style2 pin1 right Through hole angled pin header, 2x33, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x13, 2.54mm pitch, single row style2 pin1 right Through.

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