Labels Milestones
BackSOIC-8 Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (JEDEC MO-153 Var EA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated.
- Series http://www.microcrystal.com/images/_Product-Documentation/01_TF_ceramic_Packages/01_Datasheet/CC1V-T1A.pdf, hand-soldering, 3.2x1.5mm^2 package SMD.
- 1x10, 1.27mm pitch, single row Surface mounted socket.
- H[p] function hp_mm(h) = h .
- Version; non Al panel.