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2.5/6-V-5.0-EX Terminal Block, 1719257 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719257), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-136-02-xxx-DV-LC, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 48 Pin (http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=94), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-14DP-2DSA, 7 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 43045-0821 (alternative finishes: 43045-080x), 4 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P; No exposed pad - Ref http://pdfserv.maximintegrated.com/land_patterns/90-0349.PDF DFN, 10 Pin (https://www.onsemi.com/pdf/datasheet/nis5420-d.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 11.6, Wuerth electronics 9774020960 (https://katalog.we-online.de/em/datasheet/9774020960.pdf,), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, 10 bottom-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84953&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84953-4 TE FPC connector, 29 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0 TE FPC connector, 40 top-side contacts, 0.5mm pitch, 1.854mm thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole IDC header, 2x15, 2.54mm pitch, 6mm pin length, single row style2 pin1 right Through hole pin header THT 2x02 2.00mm double row Through hole straight pin header, 2x16, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted socket strip SMD 2x25 1.27mm double row Through hole angled pin header SMD 1x23 2.00mm single row style2 pin1 right Through hole angled pin header THT 2x12 2.54mm double row surface-mounted straight socket strip, 2x36, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x16 2.00mm single row Through hole angled pin header, 2x35, 1.00mm pitch, single row Through hole angled pin header, 2x05, 1.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole socket strip THT 1x06 1.00mm single row Through hole angled pin header SMD 1x18 1.27mm single row style2 pin1 right Through hole straight Samtec HPM power header series 11.94mm post length THT 1x01 1.27mm single row.

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