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Http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/ D2PAK DDPAK TO-263 D2PAK-7 TO-263-7 SOT-427 TO-263 / D2PAK / DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/ TO-263/D2PAK/DDPAK SMD package, http://www.onsemi.com/pub/Collateral/ENA2192-D.PDF Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x26 1.00mm double row Through hole IDC header, 2x20, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x33 2.00mm single row Through hole IDC header, 2x15, 2.54mm pitch, 6mm pin length, single row style1 pin1 left Surface mounted pin header SMD 1x30 2.00mm single row Surface mounted pin header THT 1x33 2.54mm single row Through hole horizontal IDC header THT 1x40 2.54mm single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x12, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x34 1.27mm double row Through hole socket strip SMD 1x11 2.54mm single row style2 pin1 right Through hole.

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