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[MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 6x-dip-switch SPST CTS_Series194-6MSTN, Piano, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 3M 14-pin zero insertion force socket, though-hole, row spacing 15.24 mm (600 mils), Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing.

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