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Strip, HLE-130-02-xxx-DV-BE, 30 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, B7PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 2 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST PUD series connector, 502585-0370 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 1 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-3210, 32 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 105310-xx04, 2 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42819-62XX, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5566-22A2, example for new part number: 5273-05A example for new part number: 26-60-5050, 5 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-18A1, example for new part number: 09-65-2108, 10 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator JST EH series connector, BM24-40DP/2-0.35V (https://www.hirose.com/product/en/download_file/key_name/BM24/category/Catalog/doc_file_id/47680/?file_category_id=4&item_id=50&is_series=1 connector Hirose DF13C SMD, CL535-0407-6-51, 7 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator JST VH series connector, DF3EA-08P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-125-02-xxx-DV-A, 25 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py mlf 8 2x2 mm 16-Lead Quad Flat, No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf Fairchild Power33 MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm VSSOP DCU R-PDSO-G8 Pitch0.5mm VSSOP-8 3.0 x 2.0mm, orientation marker at cathode, https://dammedia.osram.info/media/resource/hires/osram-dam-25688470/SFH%202201%20A01_EN.pdf PhotoDiode, plastic DIL, 4.3x4.65mm², RM5.08 PhotoDiode plastic DIL RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor sidelooker package RM2.54 package for Vishay CNY70 refective photo coupler IR Receiver Vishay TSOP-xxxx, MINICAST package, see https://www.vishay.com/docs/82669/tsop32s40f.pdf IR Receiver Vishay TSOP-xxxx, MINIMOLD package, see https://www.vishay.com/docs/82669/tsop32s40f.pdf IR Receiver Vishay TSOP-xxxx, CAST package.

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