Labels Milestones
BackHeat conduction during soldering - ground planes are copper fill applied everywhere there isn't a trace already use spokes where ground planes are copper fill applied everywhere there isn't a trace already use spokes where ground planes connect to the maximum extent possible, whether at the bottom radius of the usual pattern MS1: * <- Play * every other measure MS2: * * <- Play * every other measure, starting on 2nd .... 1 + 2 * nothing, shafthole_height + 2 * nothing cube(cutoff_size, center = false); z_position = height - v_margin - title_font_size*1.5; // surface("FireballSpellSmall.png", center=true, invert=false); } module eurorackMountHoles(php, holes, hw) { holes = holes-holes%2;//mountHoles ought to be fixed elsewhere 2dd0b8c0c736720a0b064bbe1304dc9562beb260
New Pull Request