Labels Milestones
BackSocket 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 10x-dip-switch SPST KingTek_DSHP10TJ, Slide, row spacing 7.62 mm (300 mils), Socket 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 20-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 9x-dip-switch SPST KingTek_DSHP09TS, Slide, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row.
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