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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x26, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header SMD 1x05 1.00mm single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x12 1.00mm double row Through hole angled pin header SMD 2x35 2.00mm double row.

-5.204982e-001 8.002075e-001 vertex -4.663306e-003 4.758252e+000.
3.85657 19.9472 facet normal 4.575359e-001 -7.823334e-001 4.226290e-001.
Path="/607ED812/60802B98" Ref="R111" Part="1" AR Path="/60A9C088" Ref="R?" Part="1" AR.
734-168 , 8 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated.

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