Labels Milestones
BackWidth 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 44 leads; body width 16.90 mm Power-Integrations variant of 8-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (3mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic Dual Flat No Lead Package (8MA2) - 2x3x0.6 mm Body [UDFN] (See http://www.onsemi.com/pub/Collateral/NLSV2T244-D.PDF dfn udfn dual flat.
- 958 .../precadsr-panel-holes.kicad_mod | 208 .../precadsr_panel_al/precadsr_panel_al.pro.
- (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00476-02.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr.