Labels Milestones
BackKingTek_DSHP07TJ, Slide, row spacing 7.62 mm (300 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted.
- KK 396 Interconnect System, old/engineering part.
- 8.724433e-001 3.884926e-003 4.887000e-001 facet normal 0.400391 -0.779907.
- , diameter=16.8mm, Vishay, TJ3, http://www.vishay.com/docs/34079/tj.pdf L_Toroid Horizontal series.