Labels Milestones
BackFBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole angled pin header, 2x09, 2.00mm pitch, 4.2mm pin length, double rows Through hole pin header 3-pin CPU fan Through hole angled pin header, 2x21, 1.00mm pitch, 2.0mm pin length, single row Surface mounted pin header THT 2x17 2.54mm double row Through hole angled pin header THT 2x03 2.54mm double row Through hole angled pin header THT 1x08 2.54mm single row style2 pin1 right Through hole straight socket strip, 2x01, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole.
- -9.992536e-16 -2.432956e-15 -1.000000e+00 facet normal -0.392551.
- SMD 2x07 1.27mm double.
- Schematic Merge pull request.