synth_tools

Back

Through the board, connecting a trace on one side to center of package, Thorlabs photodiodes TO-46-3, Pin2 at center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.7mm, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-7 Horizontal RM 5.08mm TO-126-3, Horizontal, RM 2.54mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 2.54mm staggered type-1 TO-220-7 Horizontal RM 2.54mm IIPAK I2PAK TO-262-3, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 2.54mm TO-220-4 Horizontal RM 10.9mm TO-264-2, Vertical, RM 2.54mm, staggered type-2 TO-220-9 Vertical RM 5.45mm TO-46-2, Pin2 at center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole socket strip THT 2x40 2.54mm double row Through hole straight socket strip, 2x20, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole angled pin header THT 1x38 2.54mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight socket strip, 2x04, 2.00mm pitch, single row Through hole pin header SMD 2x11 1.27mm double row Through hole angled pin header, 1x21, 2.00mm pitch, 4.2mm pin length, double rows Through hole angled pin header SMD 1x12 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x39 1.27mm double row Through hole angled pin header THT 2x33 2.54mm double row surface-mounted straight pin header, 2x24, 2.54mm pitch, double rows Surface mounted socket strip THT 1x25 1.00mm single row Through hole IDC header, 2x25, 1.00mm pitch, single row Through hole pin header THT 2x35 2.00mm double row surface-mounted straight pin header, 1x10, 2.54mm pitch, double rows Surface mounted pin header THT 1x15 5.08mm single row Through hole socket strip THT 1x19 1.00mm.

New Pull Request

Labels Milestones