Labels Milestones
BackHttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole vertical IDC box header THT 1x20 1.27mm single row Through hole straight socket strip, 2x13, 2.00mm pitch, double rows Surface mounted pin header SMD 1x18 1.00mm single row Through hole straight pin header, 1x29, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x16, 2.00mm pitch, 4.2mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole pin header SMD 1x15 2.54mm single row Surface mounted socket strip THT 1x30.
- Connector 3-pin PD-30S power.
- 0.194183 vertex -5.96308 -8.22545.
- 1.52046 5.97318 facet normal -0.036199 -0.0923587.
- 5.25861 3.8206 19.9 vertex 6.1206 1.7206 19.8418.