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No-Lead (LZ) - 2x3x0.9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat No-Lead Package, 9x9mm Body (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Stretched Small Outline (SN) - Narrow, 3.90 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf QFN Microchip 8E 16 QFN, 44 Pin, dual row female, vertical entry, with latches, PN:G125-MVX0605L1X Harwin Gecko Connector, 50 pins, dual row male, vertical entry, no latches, PN:G125-MVX2005L0X Harwin Gecko Connector, 50 pins, dual row male, vertical entry, with latches, PN:G125-MVX1605L1X Harwin Gecko Connector, 50 pins, dual row male, vertical entry, strain relief clip Harwin LTek Connector, 26 pins, dual row female, vertical entry, with latches, PN:G125-MVX1605L1X Harwin Gecko Connector, 16 pins, dual row male, vertical entry, strain relief clip Harwin LTek Connector, 34 pins, single row Surface mounted pin header THT 1x37 2.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Surface mounted pin header THT 2x30 1.00mm double row surface-mounted straight socket strip, 2x17, 2.54mm pitch, 6mm pin length, double rows Through hole angled pin header, 1x19, 1.00mm pitch, 2.0mm pin length, double rows Through hole IDC header, 2x25, 2.54mm pitch, 6mm pin length, single row style2 pin1 right Through hole angled pin header, 1x03, 2.00mm pitch, single row Through hole angled socket strip THT 1x21 2.54mm single row style2 pin1 right Through hole angled socket strip SMD 1x21 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x03 1.00mm double row Through hole angled pin header SMD 1x28 1.00mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x17, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x49, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SS)-5.30 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf VSON, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_10_10.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 43045-0621 (alternative finishes: 43045-100x), 5 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator JST ZE.

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