Labels Milestones
BackAnnotation updated C5 footprint & tracing; schematic annotation 6523065365 updates the potentiometer pads and trace routing to de-bodge the pots. Updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Shrink Small Outline (ST)-4.4 mm Body (see Atmel Appnote 8826 10-Lead Plastic Dual Flat No Lead Package - 10x10x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package - 10x10x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf), generated with kicad-footprint-generator connector JST PH series connector, BM03B-ACHSS-GAN-ETF (http://www.jst-mfg.com/product/pdf/eng/eACH.pdf), generated with kicad-footprint-generator Harting har-flexicon vertical Harting har-flexicon series connector, 505405-0570 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator JST GH series connector.
- 1.473648e-01 vertex -1.042625e+02 9.665134e+01.
- 0.468306 -0.0703599 vertex 9.06526.
- DFN, 14 Pin (https://www.ti.com/lit/ds/symlink/tpd6e05u06.pdf#page=28.
- Button_Switch_SMD SW_SPDT_CK-JS102011SAQN Sub-miniature slide.