Labels Milestones
Back"Layer F.Paste" "Notes": "Layer F.Paste" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Paste" "Notes": "Layer B.Paste" "Notes": "Layer F.Paste" "Notes": "Layer F.Mask" "Notes": "Layer F.Paste" "Notes": "Layer B.SilkS" ; DRILL file {KiCad 7.0.11-7.0.11~ubuntu22.04.1} date Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole Total plated holes unplated through.
- THE COST OF ALL NECESSARY SERVICING.
- Coilcraft, XAL6030-XXX, 6.56x6.76x3.1mm, https://www.coilcraft.com/getmedia/ea51f14b-7f32-4dc6-8dfe-d4b70549040f/xal60xx.pdf.
- Body, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf.