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HPM power header series 3.81mm post length THT 1x18 2.00mm single row Through hole pin header SMD 2x31 1.00mm double row Through hole IDC header, 2x05, 1.00mm pitch, double rows Surface mounted socket strip SMD 1x21 1.00mm single row Surface mounted socket strip THT 1x23 1.00mm single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x32 1.27mm double row Through hole angled socket strip THT 2x10 2.54mm double row Through hole straight socket strip, 1x34, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x03, 2.54mm pitch, double rows Through hole angled pin header, 2x06, 2.54mm pitch, single row Through hole angled pin header, 1x25, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x16 1.27mm single row Surface mounted socket strip THT 2x21 2.00mm double row surface-mounted straight pin header, 1x09, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x40 2.00mm single row Through hole straight socket strip, 2x10, 2.00mm pitch, double rows Through hole angled pin header SMD 2x07 1.27mm double row surface-mounted straight socket strip, 1x18, 2.54mm pitch, single row style2 pin1 right Through hole straight socket strip, 2x03, 2.54mm pitch, 6mm pin length, double rows Through hole straight socket strip, 1x23, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x38, 2.00mm pitch, 4.2mm pin length, single row male, vertical entry, PN:G125-FVX3405L0X Harwin Gecko Connector, 26 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf Fairchild Power33 MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A Zynq-7000 BGA.

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