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SOIC, 18 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=30523), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4020, 2 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 1, Wuerth electronics 9775066960 (https://katalog.we-online.com/em/datasheet/9775066960.pdf), generated with kicad-footprint-generator connector Molex Mega-Fit side entry Molex Pico-Clasp series connector, 502382-0470 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_5_05-08-1635.pdf TSOT, 6 Pin (https://www.onsemi.com/pdf/datasheet/ncp349-d.pdf#page=12), generated with kicad-footprint-generator Soldered wire connection, for 5 times 1 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 1.5mm, hole diameter 2.0mm 2.

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