Labels Milestones
Back- 3x3 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body with Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 5-lead though-hole mounted DIP.
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