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ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP 8pin thermal pad HTSSOP32: plastic thin shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_8_05-08-1719.pdf DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 14-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic Shrink Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 32-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 32-lead dip package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST , Piano, row spacing 25.4 mm (1000 mils), Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 9x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 3x-dip-switch SPST Omron_A6S-310x, Slide, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 4x-dip-switch SPST Copal_CVS-04xB, Slide, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD.

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