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2x Sockets, all three pins need wires: - glide in (j16/j17 // cv out (j7/j6) // pause cv in (j18/j19 // 10 steps (sw1-sw10 // 1 hp from side to center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads molded, narrow, drill 0.75mm, hand-soldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with pin 2 and 3 https://youtu.be/frLXzG9-W3Q?t=1197 (variants, especially in the digital realm, or perhaps an external CV-to-pulse-rate module? Is this even useful? Seven-segment display. Can be done, but requires a lot of wiring and increases risk of noise on power rails. Things best left to external modules: - CV-controlled CV offset module - add a global/master pitch control/modulation function with a knob and with CV control of pitch and gate CV between 1 and 2 connected via insulated copper area below body, vias included.

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