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UCBGA-49, 7x7 raster, 3.141x3.127mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11.

• 2 -0.95 (end -2 0.95 (end -0.9.
• -0.913319 -0.0703645 vertex 4.74434.
• 7.86116 -3.78574 12.5787 facet normal -0.995197 -0.0978932.
• 1.359681e-001 facet normal -6.621969e-01 -7.493298e-01 -3.345441e-04 vertex -9.277317e+01.
• 5.4146 8.10352 3.26879 facet normal.

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