Labels Milestones
BackThermally Enhanced Thin Shrink Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true 6-pin plasic small outline package; 8 leads; body width 4.4 mm; thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506BU.PDF 8-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package.
- Ref="R14" Part="1" AR Path="/607ED812/607F01E7" Ref="R25" Part="1" AR Path="/607ED812/60A9C081.
- 6.94785 6.0001 facet normal -0.601759 0.737729.
- Mounting-holes-distance 25mm mounting-hole-offset 25mm 15-pin.