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Diameter=40mm, height=50mm, Electrolytic Capacitor, , http://www.vishay.com/docs/28325/021asm.pdf CP Axial series Axial Horizontal pin pitch 5.00mm diameter 7.5mm C, Axial series, Axial, Vertical, pin pitch=5.08mm, , length*diameter=16*9.5mm^2, Vishay, IM-10-37, http://www.vishay.com/docs/34030/im10.pdf Inductor Axial series Axial Horizontal pin pitch 15.00mm length 16.5mm width 11.8mm Capacitor C, Rect series, Radial, pin pitch=7.50mm, diameter=16mm, height=25mm, Non-Polar Electrolytic Capacitor CP Axial series Axial Horizontal pin pitch 5.08mm size 40.6x9.8mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type175_RT02703HBLC pitch 7.5mm Varistor, diameter 7mm, width 5.7mm, pitch 5mm size 40x9.8mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00010 pitch 5mm size 17.3x14mm^2 drill 1.15mm pad 3mm Terminal Block WAGO 236-136 45Degree pitch 10mm size 55x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00293, 8 pins, https://www.diodes.com/assets/Datasheets/ZXSBMR16PT8.pdf 8-pin SOT-383FL package, http://www.onsemi.com/pub_link/Collateral/ENA2267-D.PDF SOT-543 4 lead surface package SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 24 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 32 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf TSSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_5x6mm_MF_C04210B.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430g2755.pdf#page=70 JEDEC MO-220 variant VEED-6), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-134-02-xxx-DV-BE-A, 34 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Molex CLIK-Mate series connector, S11B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-172 , 12 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-118-02-xxx-DV-BE-LC, 18 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator JST PUD series connector, B3B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Capacitor SMD 01005 (0402 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.vishay.com/docs/20056/crcw01005e3.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 43915-xx14, With thermal vias in pads, 2.

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