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Back(https://www.onsemi.com/pub/Collateral/NB3N551-D.PDF#page=7), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 22-27-2121, 12 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM03B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 8-Lead Plastic Small Outline (ST)-4.4 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic TSSOP (4.4mm); Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 16 leads; body.
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