Labels Milestones
BackSingle (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (3mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic Shrink Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Stretched Small Outline (SS)-5.30 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic Micro Small Outline (SN) - Narrow, 3.90 mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 28 leads; body width 16.90 mm Power-Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (see.
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