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1.85mm wire loop with bead as test point, pitch 7.62mm, hole diameter 1.0mm low profile wire loop as test Point, square 2.5mm side length, hole diameter 1.4mm wire loop bead wire loop as test point, loop diameter 3.5mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex LSHM 0.50 mm Razor Beam High-Speed Hermaphroditic Terminal/Socket Strip, LSHM-110-xx.x-x-DV-S, 10 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000992393), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 1 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Resistor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.nikhef.nl/pub/departments/mt/projects/detectorR_D/dtddice/ERJ2G.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Thin Shrink Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 10 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 24 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 28 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_32.pdf), generated with kicad-footprint-generator JST J2100 horizontal JST EH series connector, BM12B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-5060, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf.

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