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Pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Narrow Body (QR)-.150" Body [QSOP] (http://www.allegromicro.com/~/media/Files/Datasheets/ACS726-Datasheet.ashx?la=en Allegro Microsystems 24-Lead Plastic QFN (2mm x 2mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CN (see ON Semiconductor 506AF.PDF DKD Package.

• 31.5x15mm^2, drill diamater 1.2mm, pad diameter 2.1mm.
• 1.59974 -9.31122 3.54602 facet normal -0.478923 -0.594346 0.646054.
• -0.0154455 0.484683 0.874554 facet normal.
• -0.290244 0.110892 facet normal 0.0765948 0.956711 0.280779 facet.

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