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350mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket THT DIP DIL ZIF 25.4mm 1000mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 4x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf sensor pressure ssop 98ARH99089A pressure sensor with stainless steel cap Egg with 42x60mm Body-Size, ClassA, according to land-pattern PL-005, including GND vias (https://ww2.minicircuits.com/pcb/98-pl005.pdf Mini-circuits.

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