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Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 0.65mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 54 Pin (https://www.nxp.com/docs/en/package-information/98ASA10506D.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 5566-18A2, example for new part number: 26-60-4050, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator connector Molex Pico-EZmate series connector, S10B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 4, Wuerth electronics barrel jack cui dc power Thin-pin DC Barrel Jack, https://www.cliffuk.co.uk/products/dcconnectors/FC681465S.pdf Surface-mount DC Barrel Jack, https://cdn-shop.adafruit.com/datasheets/21mmdcjackDatasheet.pdf Barrel jack connector (5.5 mm outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-142-02-xxx-DV-A, 42 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator connector Molex Pico-EZmate_Slim series connector, B4B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xxx-DV-BE-A, 12 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 36 Pin (http://www.ti.com/lit/ds/slvsba5d/slvsba5d.pdf#page=35), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_20_05-08-1742.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Analog LFCSP, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin thermal pad HTSSOP32: plastic thin shrink small outline package; 56 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 40 leads (see NXP sot054_po.pdf TO-92 2-pin variant by Heraeus, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 32 leads; body width 5.3 mm; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 2x-dip-switch SPST Copal_CVS-02xB, Slide, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 10.8x32.04mm 12x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x4.1mm DIP Switch SPST Slide 6.73mm 264mil SMD LowProfile SMD 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 3x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 24.13 mm (950 mils), SMDSocket, LongPads 32-lead dip package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP DIL PDIP 2.54mm 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted.

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