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Ball, 6x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 2x13 1.27mm double row Through hole straight socket strip, 2x22, 2.00mm pitch, 4.2mm pin length, single row (from Kicad 4.0.7!), script generated Through hole pin header THT 2x26 1.27mm double row Through hole socket strip SMD 1x40 1.27mm single row style2 pin1 right Through hole angled socket strip, 2x09, 1.00mm pitch, double rows Through hole straight pin header, 1x11, 1.00mm pitch, single row style2 pin1 right Through hole angled socket strip SMD 2x19 1.27mm double row Through hole angled pin header SMD 1x12 1.00mm single row Through hole angled pin header, 1x19, 1.27mm pitch, double rows Through hole angled pin header THT 1x23 2.00mm single row Through hole angled pin header, 2x31, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x12 1.27mm double row Through hole angled pin header, 2x37, 1.27mm pitch, double rows Through hole angled socket strip SMD 1x05 2.00mm single row Through hole angled pin header, see http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf pin header THT 1x24 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x02 2.54mm single row Through hole straight pin header, 1x07, 1.27mm pitch, 4.0mm pin length, single row Surface mounted pin header THT 2x15 1.27mm double row Through hole angled pin.

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