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Bluetooth https://www.yuden.co.jp/wireless_module/document/datareport2/en/TY_BLE_EYSGJNZ_DataReport_V1_9_20180530E.pdf Taiyo Yuden NRF51822 Module Bluetooth https://www.yuden.co.jp/wireless_module/document/datareport2/en/TY_BLE_EYSGJNZ_DataReport_V1_9_20180530E.pdf Taiyo Yuden NRF51822 Module Bluetooth https://www.yuden.co.jp/wireless_module/document/datareport2/en/TY_BLE_EYSGJNZ_DataReport_V1_9_20180530E.pdf Taiyo Yuden NRF51822 Module Bluetooth https://www.yuden.co.jp/wireless_module/document/datareport2/en/TY_BLE_EYSGJNZ_DataReport_V1_9_20180530E.pdf Taiyo Yuden NRF51822 Module Bluetooth https://www.yuden.co.jp/wireless_module/document/datareport2/en/TY_BLE_EYSGJNZ_DataReport_V1_9_20180530E.pdf Taiyo Yuden BK Series (see https://www.yuden.co.jp/productdata/catalog/mlci09_e.pdf Inductor, Walsin, WLFM201209x, 2.0x1.25x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Wuerth, WE-XHMI 8080, 8.3mmx8.8mm (Script generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0100, 10 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-04A1, example for new mpn: 39-28-908x, 4 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.1 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x27 2.00mm double row Through hole angled socket strip THT 2x14 1.27mm double row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x07 5.08mm single row Through hole straight socket strip, 1x28, 2.00mm pitch, double rows Through hole straight pin header, 1x34, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x04, 2.54mm pitch, 6mm pin length, single row Through hole angled socket strip THT 1x14 2.00mm single row style2 pin1 right Through hole straight pin header, 1x02, 2.54mm pitch, double rows Through hole angled pin header, 1x31, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x31 2.54mm single row Surface mounted pin header THT 1x06 5.08mm single row Through hole angled pin header, 2x38, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x12, 2.00mm pitch, double rows Through hole angled pin header THT 2x28 1.27mm double row Through hole angled socket strip, 2x36, 2.00mm pitch, single row style2 pin1 right Through hole IDC box header, 2x10, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x32 1.00mm double row Through hole angled pin header THT 1x33 2.54mm single row male, vertical entry Harwin LTek Connector, 3 pins, pitch 5mm, size 55x9mm^2, drill diamater 1.1mm.

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