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W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 900 1.

9.715134e+01 1.090773e+01 facet normal 3.58571e-05 -0.116097 0.993238.
0.290279 0.956942 -7.53346e-07 facet.
-0.0979087 -0.995195 -0 facet normal.

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