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Emi emc shield Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2030-IDC.pdf tag connect programming header pogo pins Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2030-IDC-NL.pdf Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2030-IDC-NL.pdf Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2030-IDC-NL.pdf Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2030-IDC.pdf tag connect programming header pogo pins Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2050-IDC-NL%20Datasheet.pdf Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2050-IDC-NL%20Datasheet.pdf Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2030-IDC-NL.pdf Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2070-IDC%20Datasheet.pdf Connector XT30 Horizontal PCB Male, https://www.bto.pl/pdf/08988/XT60IPW-M3.pdf Connector XT60 Horizontal PCB Male, https://www.tme.eu/en/Document/4acc913878197f8c2e30d4b8cdc47230/XT30UPB%20SPEC.pdf AMASS female XT60, through hole, DF13-04P-1.25DS, 4 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py eSIP-7C Vertical Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST.

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