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(http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole straight socket strip, 1x06, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x30 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x08 2.00mm double row Through hole angled pin header, 1x31, 1.00mm pitch, 2.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x07, 2.00mm pitch, 6.35mm socket length, double rows Through hole socket strip SMD 1x39 2.00mm single row Through hole straight socket strip, 2x11, 1.27mm pitch, double cols (from Kicad 4.0.7.

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