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SPST Copal_CHS-08B, Slide, row spacing 10.16 mm (400 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 5.08mm, pin-spacing 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 2.54mm TO-220F-4, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220F-7, Vertical, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Horizontal RM 10.9mm TO-264-2, Vertical, RM 2.54mm, staggered type-2 TO-220-9 Horizontal RM 2.54mm TO-218-2, Horizontal, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Horizontal RM 1.7mm staggered type-1 TO-220F-5, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 5.08mm TO-126-3, Horizontal, RM 2.54mm, staggered type-1 TO-220F-5 Vertical RM 2.54mm IIPAK I2PAK TO-262-5.

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