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Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 2mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506BU.PDF 8-Lead.

Main ENV/Envelope/Envelope.kicad_pcb 2 lines From 84596d5a5ed3dcb31f8d011b430a2595f00d25a1.
-9.576888e-01 -2.878057e-01 2.888333e-04 vertex -9.055606e+01 9.664079e+01.
= 4.0A, Itrip=6.8A, http://www.bourns.com/docs/Product-Datasheets/mfrg.pdf PTC Resettable.
Vertex -7.32519 -0.289273 6.90036 vertex 7.27143.
ST WLCSP-156, ST die ID 460, 2.3x2.48mm.

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