synth_tools

Back

Tactile switch, 7.3mm x 6.25mm package, pitch 0.35mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.5mm; see section 7.1.1 of http://www.st.com/resource/en/datasheet/stm32f401ce.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 3.639x3.971mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A Artix-7 BGA, 16x16 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments LM25119 http://www.ti.com/lit/ds/symlink/lm25119.pdf WQFN, 42 Pin (http://www.ti.com/lit/ds/symlink/ts3l501e.pdf#page=23), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-149-02-xxx-DV, 49 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator Resistor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://ecsxtal.com/store/pdf/ECS-MPI2520-SMD-POWER-INDUCTOR.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0005 example for new mpn: 39-30-0100, 5 Pins per row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53048-1310, 13 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2100_datasheet_Rev1.08.pdf (page 45)), generated with kicad-footprint-generator ipc_gullwing_generator.py Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal pad LQFP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT617-1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CD), generated with kicad-footprint-generator JST XA horizontal hook JST XA series connector, LY20-22P-DLT1, 11 Circuits (https://www.molex.com/pdm_docs/sd/2005280110_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief.

New Pull Request

Labels Milestones