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(http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 72 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/ADAU1452_1451_1450.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 4 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=10047&prodName=TLP3123), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5080, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ZE series connector, BM04B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex PicoBlade Connector System, 53048-1310, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Panelmate series connector, B5P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator.

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